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Advanced Cutting Solutions For BLM Film Components

The SYSCO ABC-40/70LCD series of machines for cutting BLM film as a component of LCD devices has received very positive industry response after innovative design changes effected in 2009. End-users have been particularly impressed by a few key features/changes:

  • The die loading/unloading flipping and sliding mechanism was moved from the inboard/outboard direction to the side of the machine body. Die inspection and shimming can now be done faster and more safely, right next to the machine. This simplifies die loading and unloading.
  • The compact design minimizes floor-space requirements.
  • Overall user-friendliness of the machine.